2.5 mm x 3.2 mm ceramic package smd tcxo i547/i747 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 8/09/11_e specifications subject to change withou t notice page 1 3 4 2 1 2.40 3.20 2.50 1.2 max. 2.0 0.9 1.3 1 2 4 3 4 1 3 2 pin connection 1 vcontrol / n.c. 2 gnd 3 output 4 vcc dimension units: mm recommended pad layout 0.10 0.10 0.65 +/-0.02 0.62 +/-0.02 product features: applications: low jitter, non-pll based output gps clipped sinewave sonet /sdh analog compensation 802.11 / wifi available ? 0.5 ppm stability t1/e1, t3/e3 note: a 0.01 f bypass capacitor is recommended between vcc (pin 4) and gnd (pin 2) to minimize power supply noise. ** not available for all temperature ranges. frequency 10mhz to 52 mhz gps frequencies 16.396mhz, 16.3676mhz, 16.367667mhz, 19.200mhz, 24.5535mhz, 26.000mhz frequency tolerance @ 25 ? c ? 1.5 ppm frequency stability vs temperature vs supply voltage ( ? 5%) vs load(10%) see frequency stability table ? 0.1 ppm max. ? .0.2 ppm max. output level clipped sinewave 0.8 v p-p min. output load clipped sinewave 10k ohms / 10 pf duty cycle (hcmos) 50% 10% frequency slope (2c steps from -20 ? c to +70 ? c) ? 0.1 ppm / ? c start time (90% of vp-p) 3.0 ms max. aging ? 1 ppm / year max. supply voltage see supply voltage table , tolerance ? current 1.5 ma max voltage control (i747) 1.5 vdc ? 1.0 vdc, ? operating see operating temperature table storage -40 ? c to +85 ? c phase noise -87 dbc/hz @ 10 hz -112 dbc/hz @ 100 hz -135 dbc/hz @ 1khz -145 dbc/hz @ 10 khz part number guide sample part number: i547-1q3-20.000 mhz package operating temperature frequencystabilit y vs temperature supply voltage frequency i547 (clipped sinewave tcxo) i747 (clipped sinewave tcvcxo) 7 = 0 ? c to +50 ? c **y = ? 0.5 ppm 3 = 3.3 v - 20.000 mhz 1 = 0 ? c to +70 ? c **n = ? 1.0 ppm 7 = 3.0 v 3 = -20 ? c to +70 ? c **o = ? 1.5 ppm 2 = 2.7 v 5 = -30 ? c to +85 ? c **p = ? 2.0 ppm 1 = 1.8 v 2 = -40 ? c to +85 ? c q = ? 2.5 ppm r = ? 3.0 ppm j = ? 5.0 ppm
2.5 mm x 3.2 mm ceramic package smd tcxo i547/i747 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 8/09/11_e specifications subject to change withou t notice page 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4 (au over ni over w base metalization). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j- std-020c, table 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d me thod 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: i - date code (yww) line 2: frequency quantity per reel 1000 a 8 +/-.3 b 4 +/-.2 c 3.5 +/-.2 d 9 +/-1 or 12 +/-3 e 60 / 80 f 180
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